Project Overview
The DI-OSVISE project is part of the larger DE:Sign initiative for sovereign chip design.
Publications
IC Power Modeling in the Era of Machine Learning: Where Do We Stand? The preprint is available here. Find an overview in the blog post.
Project Partners
The DI-OSVISE project is coordinated by HM Hochschule München University of Applied Sciences. Project partners are Technical University Darmstadt, Technical University Munich, University zu Lübeck and PlanV. Other partners are Technical University Vienna, Minres Technologies and Yosys.
